Xiaomi released its new generation of flagship foldable screen phone MIX Fold 2 tonight. After four years of unremitting efforts by R&D personnel, it finally broke through the last mile and announced that foldable screen phones have entered the practical era.

While continuously improving performance indicators such as charging and battery life, MIX Fold 2 has come up with a revolutionary solution to address the biggest pain point of foldable phone customers – heaviness. The Xiaomi MIX Fold 2 adopts the horizontal inward folding design of the previous generation foldable phone, but has been optimized in terms of body thickness.

In the unfolded state, MIX Fold 2 is equivalent to the thickness of the Type-C port plus the screen and back cover, which is almost the limit that smartphones can reach; When folded, MIX Fold 2 is equivalent to the thickness of the protective case worn on the iPhone PRO MAX.

As one of the component suppliers of MIX Fold 2, Xindao Technology has contributed to improving the charging performance of mobile phones and improving the thickness of the body.

TVS and ESD protection devices from Xindao Technology are star products used by multiple mobile phone customers. On MIX Fold 2, Xindao Technology provides TVS protection devices with a peak reverse working voltage of up to 24V, supporting a 20V USB Type-C high-voltage input, which allows customers to easily construct fast charging specifications and improve charging performance. Its ultra-high overcurrent capability (Maximum Reverse Peak Pulse Current) can also protect the phone from surges and static electricity, ensuring long-lasting durability.

Xindao Technology is still exploring smaller packaging forms. Currently, the DFN series packaging used by TVS not only occupies a very small PCB area, making it convenient for mobile phone customers to reduce the design area, but also has ultra-thin packaging dimensions, which can help customers challenge ultra-thin limits and improve body thickness.

Tonight, Xiaomi also released the latest generation of TWS earphones. Xindao Technology has developed a new generation of high current and ultra small packaging MOSFETs to meet the special needs of TWS earphones. By optimizing the MOSFET wafer and packaging design, the current capacity is increased by 30% in the traditional DFN2 * 2-6L packaging, while the thermal performance remains basically unchanged. This allows customers to easily design TWS earphones with a compact appearance and outstanding charging ability.

As Xiaomi CEO Lei Jun shared, life is long, no matter what, let us maintain our belief: always believe that beautiful things are about to happen.

Always maintain your original intention and cherish a touch of romance. Xindao Technology is willing to work with you in the world of technology to create beauty and appreciate beauty.